ECE 414 Microsystem Integration and Packaging

Introduction to integrated circuit packaging and microelectronics system integration; signal integrity; electrical, mechanical, and thermal aspects of microsystem package simulation and design; electronics packaging materials; microsystem reliability and failure mechanisms; current technology developments.

Credits

4

Cross Listed Courses

Also offered for graduate-level credit as ECE 514 and may be taken only once for credit.

Prerequisite

senior or graduate standing in ECE.