ME 478 Introduction to Electronic Packaging
This course provides a foundation on mechanical and materials aspects of electronic packaging as well as an understanding of the fundamental mechanical principles used in the design of electronic packages, boards, sub-systems, and systems with focus on their integration. Topics include design, properties, materials, interconnections, assembly processes, performance of various packaging systems, thermal management, failure mechanisms and reliability.
Slash Listed Courses
Also offered for graduate-level credit as
ME 578 and may be taken only once for credit.
Prerequisite
ME 313 or equivalent.