ECE 514 Microsystem Integration and Packaging
Introduction to integrated circuit packaging and microelectronics system integration; signal integrity; electrical, mechanical, and thermal aspects of microsystem package simulation and design; electronics packaging materials; microsystem reliability and failure mechanisms; current technology developments.
Slash Listed Courses
Also offered for undergraduate-level credit as
ECE 414 and may be taken only once for credit.
Prerequisite
senior or graduate standing in ECE.